Brian Hempel - TechDebt 2018

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Sun 27 - Mon 28 May 2018 Gothenburg, Sweden

co-located with * ICSE 2018 *

Registered user since Fri 22 Jan 2016

Name:Brian Hempel

Affiliation:University of Chicago

Personal website: http://pl.cs.uchicago.edu/

Research interests:Programming Languages

Contributions

2018

ICSE

Deuce: A Lightweight User Interface for Structured Editing

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