TechDebt 2018 International Conference on Technical Debt
Welcome to the website of TechDebt 2018.
Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.
The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.
To accelerate progress, an expanded two-day working conference format has become essential. The inaugural edition of the TechDebt Conference will be held jointly with ICSE 2018 in Gothenburg, Sweden, May 27–28, 2018. The conference is sponsored by ACM SIGSOFT and IEEE TCSE.
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Call for Papers
The First International Conference on Technical Debt will be held in Gothenburg, Sweden, on May 27-28, 2018 collocated with ICSE 2018.
Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs related to release and quality issues. The Managing Technical Debt workshop series had, since 2010, brought together practitioners and researchers to discuss and define issues related to technical debt and how they can be studied. Workshop participants reiterated the usefulness of the concept each year, shared emerging practices used in software development organizations, and emphasized the need for more research and better means for sharing emerging practices and results.
As the interest from our industry and academic researchers in Technical Debt has steadily grown, the workshop series has morphed into a full conference in 2018. Our goal for this conference on Technical Debt is to bring together leading software engineering researchers and practitioners for the purpose of exploring theoretical and practical techniques for managing technical debt.
Topics of interest
The following topics are aligned with the conference theme:
- Identification of technical debt
- Visualization of technical debt
- Analysis of technical debt
- Metrics for technical debt
- Economic models for describing or reasoning about technical debt
- Understanding causes and effects of technical debt
- Relationship of technical debt to software evolution, maintenance, and aging
- Relationship of technical debt with other activities, such as testing or requirement elicitation
- The business case for technical debt management
- Technical debt and software life-cycle management
- Technical debt within a software ecosystem
- Technical debt in designs and architecture
- Technical debt in software models
- Techniques and tools for calculating technical debt principal and interest
- Concrete practices and tools used to measure and control technical debt
- Education related to technical debt
We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories:
- Research Papers: describing innovative and significant original research in the field (up to 10 pages max.)
- Industrial Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages max)
- Short papers: Position and Future Trend Papers: describing ongoing research, new results (up to 5 pages max.)
Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2018 EasyChair conference management system and conform to the ICSE formatting guidelines.
The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of ICSE 2018. The official publication date affects the deadline for any patent filings related to published work. Purchases of additional pages in the proceedings is not allowed.
Accepted papers must be presented in person at the conference by one of the authors. Excellent papers will be considered for a Distinguished Paper Award from ACM Sigsoft.
Calendar for submission:
|* January 15:||Abstract submitted to EasyChair|
|* January 22:||Full papers entered in EasyChair|
|* March 1:||Notification of acceptance / rejection|
|* March 15:||Camera ready submission of final paper|
|* May 27-28:||Presentations|
TechDebt 2018, to be held in conjunction with ICSE 2018 in Gothenburg, Sweden, is the first International conference on Technical Debt. It brings together leading researchers and industry practitioners in this growing field. Industry plays a critical role in the understanding of the management, monitoring, and calculations of Technical Debt in real world situations, and as such, new techniques, methods and tools that can aid practitioners and decision makers in these critical tasks are cordially invited to participate at TechDebt 2018.
Industry representatives interested in participating are encouraged to submit a letter of interest directly to Dr. Clemente Izurieta (email@example.com)
All inquiries may be directed to firstname.lastname@example.org
|Philippe Kruchten||University of British Columbia||Program Co-chair|
|Frank Buschmann||Siemens AG||Program Co-chair|
|Esra Alzaghoul||University of Jordan|
|Francesca Arcelli Fontana||University of Milano Bicocca|
|Paris Avgeriou||University of Groningen|
|Stephany Bellomo||Carnegie Mellon Software Engineering Institute|
|Ayse Bener||Ryerson University|
|Christian Bird||Microsoft Research|
|Jan Bosch||Chalmers University of Technology|
|Alexander Chatzigeorgiou||University of Macedonia|
|Zadia Codabux||Colby College|
|Robert Eisenberg||Lockheed Martin|
|Hakan Erdogmus||Carnegie Mellon University|
|Davide Falessi||California Polytechnic State University|
|Juan Garbajosa||Universidad Politecnica de Madrid (UPM)|
|Johannes Holvitie||University of Turku|
|Clemente Izurieta||Montana State University|
|Andreas Jedlitschka||Fraunhofer IESE|
|Heiko Koziolek||ABB Corporate Research|
|Ville Leppänen||University of Turku|
|Antonio Martini||Chalmers University of Technology|
|Andrew Meneely||Rochester Institute of Technology|
|David Morgenthaler||Google, Inc.|
|Ipek Ozkaya||Carnegie Mellon Software Engineering Institute|
|Jennifer Perez||Technical University of Madrid (UPM)|
|Narayan Ramasubbu||University of Pittsburgh|
|Gonzalo Rojas||University of Concepcion|
|Klaus Schmid||University of Hildesheim|
|Carolyn Seaman||University of Maryland Baltimore County|
|Andriy Shapochka||SoftServe Inc.|
|Emad Shihab||Concordia University|
|Forrest Shull||Carnegie Mellon Software Engineering Institute|
|Will Snipes||ABB Corporate Research|
|Wolfgang Trumler||Siemens AG|
|Jesse Yli-Huumo||Aalto University|
|Olaf Zimmermann||University of Applied Sciences (HSR FHO)|